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| RS3A THRU RS3K Features * For surface mounted applications in order optimize board space * Low profile package * Built-in strain relief, ideal for automated placement * Fast switching speed * Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 * Low forward voltage drop * Glass passivated junction * High temperature soldering guaranteed : 250E /10 seconds, at terminals CURRENT 3.0 Amperes VOLTAGE 50 to 800 Volts DO-214AB (SMC) 0.124(3.15) 0.108(2.75) 0.245(6.22) 0.220(5.59) 0.280(7.11) 0.260(6.60) 0.012(0.31) 0.006(0.15) 0.103(2.62) 0.079(2.00) 0.050(1.27) 0.030(0.76) 0.008(0.203) MAX. 0.320(8.13) 0.305(7.75) Mechanical Data * Case : JEDEC SMC(DO-214AB) molded plastic body * Terminals : Plated axial lead solderable per MIL-STD-750, method 2026 * Polarity : Color band denotes cathode end * Weight : 0.007ounce, 0.25 gram Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25E ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=75E Peak forward surge current 8.3ms half sing wave superimposed on rated load (JEDEC method) TL=75E Maximum instantaneous forward voltage at 1.5A Maximum reverse current at rated voltage TA=25E TA=125E VRRM VRMS VDC I(AV) IFSM VF IR Trr Re JL Re JA CJ TJ TSTG RS3A 50 35 50 RS3B 100 70 100 RS3D 200 140 200 3.0 100.0 1.30 10.0 250 150 15.0 50.0 60.0 RS3G 400 280 400 RS3J 600 420 600 RS3K 800 560 800 Units Volts Volts Volts Amps Amps Volts iA 250 500 ns E /W pF E Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating unction and storage temperature range -55 to +150 Notes: (1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on 0.3 0.3"(8.0 8.0mm) copper opad areas. RATINGS AND CHARACTERISTIC CURVES RS3A THRU RS3K FIG.1-FORWARD CURRENT DERATING CURVE 3.0 RESISTIVE OR INDUCTIVE LOAD FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT(AMPERES) 125 TL=75E 8.3m SINGLE HALF SINE WAVE (JEDEC Method) AVERAGE FORWARD CURRENT (A) 100 2.0 75 1.0 P.C.B.MOUNTED ON 0.3X0.3"(8.0X8.0mm) COPPER PAD AREAS 50 0 25 0 50 100 150 200 LEAD TEMPERATURE (E ) 0 1 2 4 6 8 10 20 40 60 100 FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 100 NUMBER OF CYCLES AT 60Hz FIG.5-TYPICAL REVERSE CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT(AMPERES) TJ=125E 10 TJ=25E INSTANTANEOUS REVERSE CURRENT MICROAMPERES TJ=125E 10 TJ=40E 1 PULSE WIDTH=300ms 1% DUTY CYCLE 1 TJ=75E 0.1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 TJ=25E 0.1 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE 0.01 0 100 TRANSIENT THERMAL IMPEDANCE (E /W) 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 1 MOUNTED ON 0.20X0.27" (5X7mm) COPPER PAD AREA 0.1 0.01 0.1 1 t,PULSE DURATION,sec 10 100 |
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